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1. (WO2018199184) EVAPORATION SOURCE AND FILM DEPOSITION DEVICE
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Pub. No.: WO/2018/199184 International Application No.: PCT/JP2018/016861
Publication Date: 01.11.2018 International Filing Date: 25.04.2018
IPC:
C23C 14/24 (2006.01) ,C23C 14/14 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/10 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
24
Vacuum evaporation
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
14
Metallic material, boron or silicon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Applicants:
株式会社アルバック ULVAC, INC. [JP/JP]; 神奈川県茅ヶ崎市萩園2500番地 2500 Hagisono, Chigasaki-shi, Kanagawa 2538543, JP
Inventors:
中村 寿充 NAKAMURA, Toshimitsu; JP
星川 健児 HOSHIKAWA, Kenji; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2017-08757026.04.2017JP
Title (EN) EVAPORATION SOURCE AND FILM DEPOSITION DEVICE
(FR) SOURCE D'ÉVAPORATION ET DISPOSITIF DE DÉPÔT DE FILM
(JA) 蒸発源及び成膜装置
Abstract:
(EN) The evaporation source is provided with an evaporation source container, a heating device, a first heat-shielding plate, and second heat-shielding plates. The evaporation source container is provided with: a container body having a top face and accommodating thin-film material therein; and multiple nozzles connected to the container body, arranged in one axial direction in a protruding manner from the top face, and each having an opening part for releasing vaporized thin-film material. The heating device heats the container body. The first heat-shielding plate is disposed apart from and opposing the top face, and has multiple first openings disposed so as to correspond to the multiple nozzles, with each of the openings having a first opening region larger than the opening part on each of the nozzles and through which each of the nozzles penetrates. The second heat-shielding plates are disposed apart from and opposing the top face between the container body and the first heat-shielding plate, each affixed to one of the multiple nozzles and having a second opening part with a larger shape than the first opening region and through which each of the nozzles penetrates.
(FR) La source d'évaporation de l'invention est pourvue d'un contenant, d'un dispositif de chauffage, d'une première plaque de protection thermique et d'une seconde plaque de protection thermique. Le contenant de source d'évaporation comprend un corps présentant une face supérieure et acueillant un matériau de film mince; et de multiples buses reliées au corps de contenant, disposées dans une direction axiale de manière saillante à partir de la face supérieure, et présentant chacune une partie d'ouverture pour libérer un matériau en film mince vaporisé. Le dispositif de chauffage chauffe le corps du contenant. La première plaque de protection thermique est disposée à distance de la face supérieure et opposée à celle-ci, et comporte de multiples premières ouvertures disposées de façon à correspondre aux multiples buses, chacune des ouvertures présentant une première région plus grande que la partie d'ouverture sur chacune des buses et dans laquelle pénètre chacune des buses. Les secondes plaques de protection thermique sont disposées à distance de la face supérieure et à l'opposé de celle-ci entre le corps du contenant et la première plaque de protection thermique, chacune étant fixée à l'une des multiples buses et comportant une seconde partie d'ouverture ayant une forme plus grande que la première région d'ouverture et dans laquelle pénètre chacune des buses.
(JA) 蒸発源は、蒸発源容器と加熱装置と第1の熱遮蔽板と第2の熱遮蔽板とを具備する。蒸発源容器は、天面を有し薄膜材料を収容する容器本体と、容器本体と連結し天面から突出して一軸方向に配置され、薄膜材料の気化物質を放出する開口部を有する複数のノズルとを備える。加熱装置は容器本体を加熱する。第1の熱遮蔽板は、天面と離間して対向配置され、複数のノズル毎に対応して設けられた記ノズルが貫通するノズルの開口部よりも大きい第1の開口領域を有する複数の第1の開口部を備える。第2の熱遮蔽板は、容器本体と第1の熱遮蔽板との間に複数のノズル各々に固定されて天面と離間して対向配置され、第1の開口領域よりも大きい外形を有しノズルが貫通する第2の開口部を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)