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1. (WO2018199172) PROTECTIVE FILM
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Pub. No.: WO/2018/199172 International Application No.: PCT/JP2018/016834
Publication Date: 01.11.2018 International Filing Date: 25.04.2018
IPC:
B29C 53/04 (2006.01) ,B32B 27/00 (2006.01) ,B32B 27/28 (2006.01) ,C09J 7/20 (2018.01) ,C09J 7/30 (2018.01) ,C09J 7/38 (2018.01) ,C09J 123/00 (2006.01) ,C09J 153/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
53
Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
02
Bending or folding
04
of plates or sheets
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
28
comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
[IPC code unknown for C09J 7/20][IPC code unknown for C09J 7/30][IPC code unknown for C09J 7/38]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
123
Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
153
Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
02
Vinyl aromatic monomers and conjugated dienes
Applicants:
住友ベークライト株式会社 SUMITOMO BAKELITE CO., LTD. [JP/JP]; 東京都品川区東品川2丁目5番8号 5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP
Inventors:
小野寺 和房 ONODERA, Kazufusa; JP
Agent:
朝比 一夫 ASAHI, Kazuo; JP
増田 達哉 MASUDA, Tatsuya; JP
Priority Data:
2017-08668325.04.2017JP
Title (EN) PROTECTIVE FILM
(FR) FILM PROTECTEUR
(JA) 保護フィルム
Abstract:
(EN) This protective film 10 is used adhered on to a resin substrate 21, when thermal-bending the resin substrate 21 under heat. The protective film 10 has a base material layer and an adhesive layer positioned between this base material layer and the resin substrate 21 and adhering to the resin substrate 21. The adhesive layer contains polyolefin and a styrene block elastomer having a styrene content of no more than 25 wt%.
(FR) L'invention concerne un film protecteur (10) qui est utilisé collé sur un substrat en résine (21), lors du cintrage thermique du substrat en résine (21) sous de la chaleur. Le film protecteur (10) comprend une couche de matériau de base et une couche adhésive disposée entre cette couche de matériau de base et le substrat en résine (21) et adhérant au substrat en résine (21). La couche adhésive contient une polyoléfine et un élastomère séquencé de styrène ayant une teneur en styrène inférieure ou égale à 25 % en poids.
(JA) 本発明の保護フィルム10は、樹脂基板21に対して、加熱下で熱曲げ加工を施す際に、この樹脂基板21に貼付して用いられる。保護フィルム10は、基材層と、この基材層と樹脂基板21との間に位置し、樹脂基板21に粘着する粘着層とを有する。粘着層は、ポリオレフィンと、スチレンの含有量が25wt%以下のスチレンブロックエラストマーとを含有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)