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1. (WO2018199156) METHALLYL GROUP-CONTAINING RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME

Pub. No.:    WO/2018/199156    International Application No.:    PCT/JP2018/016783
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Apr 26 01:59:59 CEST 2018
IPC: C08F 12/34
Applicants: NIPPON KAYAKU KABUSHIKI KAISHA
日本化薬株式会社
Inventors: KUBOKI Kenichi
窪木 健一
MATSUURA Kazuki
松浦 一貴
NAKANISHI Masataka
中西 政隆
Title: METHALLYL GROUP-CONTAINING RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME
Abstract:
Provided are: a methallyl group-containing resin which enables a curable resin composition to provide a cured product having excellently low moisture absorbency, excellent heat resistance and excellent dielectric characteristics, if used in the curable resin composition; a curable resin composition; and a cured product of the curable resin composition. A methallyl group-containing resin according to the present invention is represented by formula (1). (In the formula, Z represents a single bond, a hydrocarbon group, a carbon atom to which a heterocyclic ring is bonded, or the like; each Y represents a hydrogen atom or a methallyl group, and 20% or more of all Y moieties are methallyl groups; each R represents a hydrogen atom or the like; n represents an average that is a real number of 1-20; m represents an average that is a real number of 0-10, provided that in cases where m is 0, Z is not a single bond or a fluorene group; and the dotted line indicates the possible presence of a phenyl group.)