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1. (WO2018199133) FLEXIBLE WIRING CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND IMAGING DEVICE
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Pub. No.: WO/2018/199133 International Application No.: PCT/JP2018/016739
Publication Date: 01.11.2018 International Filing Date: 25.04.2018
IPC:
H05K 1/02 (2006.01) ,H01L 27/146 (2006.01) ,H04N 5/225 (2006.01) ,H05K 3/28 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-2, Shimo-hozumi 1-chome, Ibaraki-shi, Osaka 5678680, JP
Inventors:
柴田 周作 SHIBATA, Shusaku; JP
河邨 良広 KAWAMURA, Yoshihiro; JP
高倉 隼人 TAKAKURA, Hayato; JP
若木 秀一 WAKAKI, Shuichi; JP
Agent:
岡本 寛之 OKAMOTO, Hiroyuki; JP
宇田 新一 UDA, Shinichi; JP
Priority Data:
2017-09016528.04.2017JP
2018-08330524.04.2018JP
Title (EN) FLEXIBLE WIRING CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND IMAGING DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF D'IMAGERIE
(JA) フレキシブル配線回路基板、その製造方法、および、撮像装置
Abstract:
(EN) This flexible wiring circuit board is provided with a first insulating layer, first wiring arranged on one side of the first insulating layer in the thickness direction, an adhesive layer arranged on one side of the first wiring in the thickness direction, and a second insulating layer arranged on one side of the adhesive layer in the thickness direction, wherein the adhesive layer contains a reinforcing fiber layer having insulating properties.
(FR) La présente invention concerne une carte de circuit imprimé flexible pourvue d'une première couche isolante, d'un premier câblage disposé d'un côté de la première couche isolante dans la direction de l'épaisseur, d'une couche adhésive disposée d'un côté du premier câblage dans la direction de l'épaisseur, et d'une seconde couche isolante disposée d'un côté de la couche adhésive dans la direction de l'épaisseur, la couche adhésive contenant une couche de fibres de renfort ayant des propriétés isolantes.
(JA) フレキシブル配線回路基板は、第1絶縁層と、第1絶縁層の厚み方向一方側に配置される第1配線と、第1配線の厚み方向一方側に配置される接着剤層と、接着剤層の厚み方向一方側に配置される第2絶縁層とを備え、接着剤層は、絶縁性を有する強化繊維層を含有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)