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1. (WO2018199129) FLEXIBLE WIRING CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE

Pub. No.:    WO/2018/199129    International Application No.:    PCT/JP2018/016723
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Apr 26 01:59:59 CEST 2018
IPC: H05K 1/03
C08G 73/10
H05K 1/02
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: SHIBATA, Shusaku
柴田 周作
TAKAKURA, Hayato
高倉 隼人
KAWAMURA, Yoshihiro
河邨 良広
WAKAKI, Shuichi
若木 秀一
Title: FLEXIBLE WIRING CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE
Abstract:
This mounting board is provided with a base insulating layer, a conductor pattern and a cover insulating layer, arranged in that order toward one side in the thickness direction. The entire bottom surface of the base insulating layer is exposed downwards. The total thickness of the base insulating layer and the cover insulating layer is less than or equal to 16 μm. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of less than or equal to 15×10-6/%RH.