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|1. (WO2018199129) FLEXIBLE WIRING CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE|
|Applicants:||NITTO DENKO CORPORATION
|Title:||FLEXIBLE WIRING CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE|
This mounting board is provided with a base insulating layer, a conductor pattern and a cover insulating layer, arranged in that order toward one side in the thickness direction. The entire bottom surface of the base insulating layer is exposed downwards. The total thickness of the base insulating layer and the cover insulating layer is less than or equal to 16 μm. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of less than or equal to 15×10-6/%RH.