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1. (WO2018199084) WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/199084    International Application No.:    PCT/JP2018/016589
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Wed Apr 25 01:59:59 CEST 2018
IPC: H05K 3/46
H05K 3/00
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: SEKIMOTO, Yasuyuki
関本 裕之
Title: WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Abstract:
A wiring substrate (101) is provided with: two or more insulation layers (2a, 2b) comprising an expandable insulating material as a main material and forming a laminated body (1); an electrically conductive layer (7) comprising an expandable electrically conductive material as a main material and disposed at a boundary of the insulation layers in the laminated body (1); and at least one metal foil pattern (4) which is positioned on the outer-most side of the laminated body (1) and which is disposed so as to cover at least a part of a main surface (1u) oriented in a direction parallel with a lamination direction of the laminated body (1).