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1. (WO2018199071) ACOUSTIC WAVE DEVICE MANUFACTURING METHOD AND ACOUSTIC WAVE DEVICE

Pub. No.:    WO/2018/199071    International Application No.:    PCT/JP2018/016563
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Wed Apr 25 01:59:59 CEST 2018
IPC: H03H 3/08
H03H 9/145
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: NAKAI, Yasuharu
中井 康晴
HORIKAWA, Harunobu
堀川 晴信
Title: ACOUSTIC WAVE DEVICE MANUFACTURING METHOD AND ACOUSTIC WAVE DEVICE
Abstract:
Provided is an acoustic wave device manufacturing method with which a resist residue is less likely to remain and degradation in electric characteristics is less likely to occur, and which makes it possible to increase productivity. An acoustic wave device 1 manufacturing method is a method for manufacturing an acoustic wave device 1 having an IDT electrode 3 and is provided with: a step of preparing a piezoelectric substrate 2; a step of forming on the piezoelectric substrate 2 a first inner bus bar 4a, a plurality of first electrode fingers 4b, a second inner bus bar 5a, a plurality of second electrode fingers 5b, a plurality of first connection electrodes 4c, and a plurality of second connection electrodes 5c by a lift-off process; a step of forming a first bus bar 14 having a plurality of first opening portions 8 by forming a first outer bus bar 6 on the piezoelectric substrate 2 so as to cover a part of the plurality of first connection electrodes 4c; and a step of forming a second bus bar 15 having a plurality of second opening portions 9 by forming a second outer bus bar 7 on the piezoelectric substrate 2 so as to cover a part of the plurality of second connection electrodes 5c.