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1. (WO2018199022) ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Pub. No.:    WO/2018/199022    International Application No.:    PCT/JP2018/016457
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Tue Apr 24 01:59:59 CEST 2018
IPC: H05K 1/02
H01L 23/12
H01L 23/36
H01L 33/64
Applicants: KYOCERA CORPORATION
京セラ株式会社
Inventors: KITAZUMI,Noboru
北住 登
Title: ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Abstract:
An electronic element mounting substrate comprising: a rectangular substrate having a first major surface and a second major surface opposing the first major surface; and heat-dissipation bodies which are embedded in a row in the substrate, the heat-dissipation bodies being made from a carbon material and having a third major surface positioned on the first major surface side in a thickness direction and a fourth major surface opposing the third major surface. In a transparent plan view, the heat-dissipation bodies are more thermally conductive in a direction perpendicular to a direction of the row of the heat-dissipation bodies than in the direction of the row of the heat-dissipation bodies.