Search International and National Patent Collections

1. (WO2018199017) WIRED CIRCUIT BOARD AND IMAGING DEVICE

Pub. No.:    WO/2018/199017    International Application No.:    PCT/JP2018/016447
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Tue Apr 24 01:59:59 CEST 2018
IPC: H01L 27/146
H04N 5/225
H04N 5/369
H05K 1/02
H05K 3/34
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: TAKAKURA, Hayato
高倉 隼人
WAKAKI, Shuichi
若木 秀一
SHIBATA, Shusaku
柴田 周作
KAWAMURA, Yoshihiro
河邨 良広
ITO, Masaki
伊藤 正樹
Title: WIRED CIRCUIT BOARD AND IMAGING DEVICE
Abstract:
This wired circuit board comprises: a first insulating layer; a terminal; a second insulating layer disposed on one side in the thickness direction of the terminal; and wires continuing in a direction crossing the terminal and the thickness direction. The first insulating layer includes an opening section penetrating in the thickness direction and having an opening cross-sectional area that increases toward the one side in the thickness direction. The terminal has: a peripheral edge section in contact with an inner side surface of the first insulating layer forming the opening section; and a solid section integrally disposed with the peripheral edge section, on the inner side of the peripheral edge section. The peripheral edge section and the solid section fill all of the opening section.