Search International and National Patent Collections

1. (WO2018198899) REACTIVE HOT MELT ADHESIVE

Pub. No.:    WO/2018/198899    International Application No.:    PCT/JP2018/015964
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Apr 19 01:59:59 CEST 2018
IPC: C09J 175/08
C09J 11/00
C09J 133/00
C09J 175/06
Applicants: THE YOKOHAMA RUBBER CO., LTD.
横浜ゴム株式会社
Inventors: MATSUMURA Misaki
松村 美沙樹
Title: REACTIVE HOT MELT ADHESIVE
Abstract:
The purpose of the present invention is to provide a reactive hot melt adhesive which exhibits high bonding strength at high temperatures, while having excellent durability. The present invention is a reactive hot melt adhesive which contains a thermoplastic poly(meth)acrylic resin and a urethane prepolymer that is formed from a polyol and a polyisocyanate, and wherein the polyol contains bifunctional polyols including a polypropylene glycol and a polyethylene glycol, a trifunctional polyol and a polyester polyol having a glass transition temperature of 20-60°C.