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1. (WO2018198864) FILM AND METHOD FOR PRODUCING FILM
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Pub. No.: WO/2018/198864 International Application No.: PCT/JP2018/015750
Publication Date: 01.11.2018 International Filing Date: 16.04.2018
IPC:
C08J 5/18 (2006.01) ,B29C 55/12 (2006.01) ,B32B 27/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
55
Shaping by stretching, e.g. drawing through a die; Apparatus therefor
02
of plates or sheets
10
multiaxial
12
biaxial
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
荘司 秀夫 SHOJI, Hideo; JP
田中 照也 TANAKA, Teruya; JP
真鍋 功 MANABE, Isao; JP
Priority Data:
2017-08501824.04.2017JP
2018-01025225.01.2018JP
Title (EN) FILM AND METHOD FOR PRODUCING FILM
(FR) FILM ET PROCÉDÉ DE PRODUCTION D'UN FILM
(JA) フィルム、及びフィルムの製造方法
Abstract:
(EN) A film characterized by having a stress at 5% elongation at 25°C, Ta, of 1.0-20.0 MPa. In cases when dimensional change at 90°C during heating from 25°C to 160°C at a rate of 10 °C/min under a load of 120 g/mm2 is referred to as 90°C dimensional change 1 and when the direction in which the 90°C dimensional change 1 is maximum is referred to as X direction, the direction which is perpendicular to the X direction within the plane of the film is referred to as Y direction, and the X-direction 90°C dimensional change is expressed by T×1 (%), then the film is characterized in that T×1 is -10.00% or greater but not greater than 10.00%. The film has both heat resistance sufficient for maintaining the flatness in heating steps and flexibility sufficient for uses as a dicing pressure-sensitive adhesive film, etc., and is suitable for use as a substrate for semiconductor production steps.
(FR) L'invention concerne un film caractérisé en ce qu'il présente une contrainte à 5 % d'élongation à 25 °C, Ta, de 1,0 à 20,0 MPa. Dans les cas dans lesquels le changement dimensionnel à 90 °C, au cours d'un chauffage de 25 °C à 160 °C à une vitesse de montée en température de 10 °C/min sous une charge de 120 g/mm2 est appelé changement dimensionnel à 90 °C 1, et dans lesquels la direction dans laquelle le changement dimensionnel à 90 °C 1 est maximum est appelée direction X, la direction qui est perpendiculaire à la direction X dans le plan du film est appelée direction Y, et le changement dimensionnel à 90 °C dans la direction X est exprimé par T×1 (%), alors le film est caractérisé en ce que T×1 vaut -10,00 % ou plus, mais n'est pas supérieur à 10,00 %. Le film présente tant une résistance à la chaleur suffisante pour maintenir la planéité au cours des étapes de chauffage qu'une souplesse suffisante pour des utilisations en tant que film adhésif sensible à la pression de découpage en dés, etc., et convient à une utilisation en tant que substrat pour des étapes de production de semi-conducteurs.
(JA) 25℃における5%伸張時応力Taが、1.0MPa以上20.0MPa以下であり、120g/mmの荷重をかけて、25℃から160℃まで昇温速度10℃/分で昇温した際の90℃における寸法変化率を90℃寸法変化率1、90℃寸法変化率1が最大となる方向をX方向、X方向とフィルム面内で直交する方向をY方向、X方向の90℃寸法変化率をTx1(%)としたときに、Tx1が-10.00%以上10.00%以下であることを特徴とする、フィルム。 加熱工程において平面性を維持することができる程度の耐熱性、及びダイシング用粘着フィルム等として使用するのに十分な柔軟性を具備する、半導体製造工程用基材として好適なフィルムを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)