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1. (WO2018198856) CIRCUIT MODULE AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2018/198856 International Application No.: PCT/JP2018/015699
Publication Date: 01.11.2018 International Filing Date: 16.04.2018
IPC:
H01L 23/28 (2006.01) ,H01L 21/56 (2006.01) ,H01L 23/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
岡田 貴浩 OKADA, Takahiro; JP
佐藤 和茂 SATO, Kazushige; JP
菅野 喬文 KANNO, Takafumi; JP
天知 伸充 AMACHI, Nobumitsu; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2017-09040028.04.2017JP
Title (EN) CIRCUIT MODULE AND METHOD FOR MANUFACTURING SAME
(FR) MODULE DE CIRCUIT ET SON PROCÉDÉ DE FABRICATION
(JA) 回路モジュールおよびその製造方法
Abstract:
(EN) A circuit module (101) is provided with: a wiring board (1) having a main surface (1u); an electronic component (3) mounted on the main surface (1u); and a sealing resin (4) that covers, on the main surface (1u), at least a part of the electronic component (3). A recess (7) is formed at least in a part of a side surface (11) of the sealing resin (4), and at least the recess (7) is covered with a conductive film (6).
(FR) L'invention concerne un module de circuit (101) comprenant : une carte de câblage (1) ayant une surface principale (1u); un composant électronique (3) monté sur la surface principale (1u); et une résine d'étanchéité (4) qui recouvre, sur la surface principale (1u), au moins une partie du composant électronique (3). Un évidement (7) est formé au moins dans une partie d'une surface latérale (11) de la résine d'étanchéité (4), et au moins l'évidement (7) est recouvert d'un film conducteur (6).
(JA) 回路モジュール(101)は、主表面(1u)を有する配線基板(1)と、主表面(1u)に実装された電子部品(3)と、主表面(1u)上において電子部品(3)の少なくとも一部を覆う封止樹脂(4)とを備え、封止樹脂(4)の側面(11)の少なくとも一部に凹み(7)が形成されており、少なくとも凹み(7)が導電性膜(6)で覆われている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)