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1. (WO2018198838) SOLDER SAMPLE MANAGEMENT SYSTEM, SOLDER MANAGEMENT SERVER DEVICE, AND SOLDER SAMPLE MANAGEMENT METHOD

Pub. No.:    WO/2018/198838    International Application No.:    PCT/JP2018/015603
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Sat Apr 14 01:59:59 CEST 2018
IPC: B23K 1/00
B23K 3/06
Applicants: NIHON SUPERIOR CO., LTD.
株式会社日本スペリア社
Inventors: NISHIMURA Tetsuro
西村 哲郎
Title: SOLDER SAMPLE MANAGEMENT SYSTEM, SOLDER MANAGEMENT SERVER DEVICE, AND SOLDER SAMPLE MANAGEMENT METHOD
Abstract:
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquiring unit 72 which transmits the tank identification information and the sample identification information to a solder management server device 1, wherein the solder management server device 1 includes: a sample information storage unit 17 which associates with one another and stores the tank identification information and the sample identification information transmitted from the smartphone 7; and an analysis result acquiring unit 12 which acquires a component analysis result of a sample accommodated in the container 6 and the sample identification information assigned to the container 6, and causes the same to be associated with one another and stored by the sample information storage unit 17.