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1. (WO2018198732) BOARD CONNECTOR
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Pub. No.: WO/2018/198732 International Application No.: PCT/JP2018/014837
Publication Date: 01.11.2018 International Filing Date: 09.04.2018
Chapter 2 Demand Filed: 17.08.2018
IPC:
H01R 12/71 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70
Coupling devices
71
for rigid printing circuits or like structures
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
川島 直倫 KAWASHIMA, Naomichi; JP
小森 洋和 KOMORI, Hirokazu; JP
Agent:
特許業務法人グランダム特許事務所 GRANDOM PATENT LAW FIRM; 愛知県名古屋市中区栄二丁目4番1号 広小路栄ビルディング3階 Hirokoji Sakae Bldg. 3F, 4-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2017-08947128.04.2017JP
Title (EN) BOARD CONNECTOR
(FR) CONNECTEUR POUR SUBSTRAT
(JA) 基板用コネクタ
Abstract:
(EN) Provided is a board connector which can be stably mounted on a circuit board. A board connector (A) comprises: a housing (10) mounted on a circuit board (P) and having a terminal holding part (11) and a hood part (13) extending forwardly from the outer circumferential edge of the terminal holding part (11); terminal fittings (25, 26) attached to the terminal holding part (11) in a penetrating state and capable of being connected to the circuit board (P) while mounted on the circuit board (P) at the back of the terminal holding part (11); and a locking part (19) formed on the housing (10) and locked to the circuit board (P), thereby regulating the forward tilting displacement of the housing (10).
(FR) L’invention concerne un connecteur pour substrat pouvant être monté de façon stable sur une carte de circuit imprimé. Plus spécifiquement, ce connecteur (A) pour substrat comporte: un boîtier (10) monté sur une carte (P) de circuit imprimé, lequel boîtier possède une partie (11) support de borne et une partie (13) capuchon qui s’étend vers l’arrière à partir du bord périphérique externe de la partie (11) support de borne; des raccords (25, 26) de borne pouvant être connectés à la carte (P) de circuit imprimé au niveau arrière de la partie (11) support de borne, lesquels raccords sont montés de façon à passer à travers la partie (11) support de borne; et une partie (10) de verrouillage formée dans le boîtier (10) laquelle, par verrouillage sur la carte (P) de circuit imprimé permet de commander les variations d’inclinaison vers l’avant du boîtier (10).
(JA) 回路基板に対し安定して載置可能な基板用コネクタを提供する。 基板用コネクタ(A)は、回路基板(P)に載置され、端子保持部(11)と、端子保持部(11)の外周縁から前方へ延出したフード部(13)とを有するハウジング(10)と、端子保持部(11)に貫通状態で取り付けられ、端子保持部(11)の後方において回路基板(P)に対し載置した状態で接続可能な端子金具(25,26)と、ハウジング(10)に形成され、回路基板(P)に係止することでハウジング(10)の前傾変位を規制する係止部(19)とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)