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1. (WO2018198707) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE OPERATING METHOD

Pub. No.:    WO/2018/198707    International Application No.:    PCT/JP2018/014560
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Fri Apr 06 01:59:59 CEST 2018
IPC: H01L 21/304
B24B 37/10
B24B 37/12
H01L 21/02
H01L 21/677
Applicants: EBARA CORPORATION
株式会社 荏原製作所
Inventors: SHINOZAKI, Hiroyuki
篠崎 弘行
SOBUKAWA, Hiroshi
曽布川 拓司
TSUJIMURA, Manabu
辻村 学
SAKATA, Keisuke
坂田 桂介
OTSU, Kazuya
大津 和也
KANEHIRA, Masayuki
金平 昌幸
Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE OPERATING METHOD
Abstract:
The present invention relates to a method for diminishing the peak power of a substrate processing device. In addition, the present invention relates to a substrate processing device operating method for processing a substrate such as a wafer. The substrate processing method comprises: calculating the expected polishing time from a polishing recipe; calculating the expected washing time from a washing recipe; calculating a polishing throughput index value by dividing the expected polishing time by the number of polishing units within a polishing section; calculating a washing throughput index value by dividing the expected washing time by the number of washing lanes inside a washing section; and lowering the set value for the operation acceleration of a washing-side substrate transport system if the polishing throughput index value is greater than the washing throughput index value, while lowering the set value for the operation acceleration of a polishing-side substrate transport system if the washing throughput index value is greater than the polishing throughput index value.