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1. (WO2018198655) MANUFACTURING METHOD FOR ORGANIC DEVICE

Pub. No.:    WO/2018/198655    International Application No.:    PCT/JP2018/013010
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Mar 29 01:59:59 CEST 2018
IPC: H05B 33/10
B26D 7/20
B26F 1/44
H01L 51/50
H05B 33/04
Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED
住友化学株式会社
Inventors: FUJII Takashi
藤井 貴志
MATSUMOTO Yasuo
松本 康男
MORISHIMA Shinichi
森島 進一
Title: MANUFACTURING METHOD FOR ORGANIC DEVICE
Abstract:
A manufacturing method for an organic device 1 includes: a forming step for forming a plurality of organic device parts 10 with predetermined intervals therebetween on one main surface 3a of a support substrate 3 that extends in one direction, each organic device part having at least a first electrode layer 5, an organic functional layer 7, and a second electrode layer 9 laminated in this order; a bonding step for bonding, along the one direction, a sealing member 11 that extends in the one direction, such that a part of the first electrode layer 5 and a part of the second electrode layer 9 in each organic device part 10 are respectively exposed, and such that the sealing member straddles the plurality of organic device parts 10; and a cutting step for dividing the organic device parts 10 into individual pieces. In the cutting step, cutting blades B enter from the other main surface 3b side of the support substrate 3 in a state where the sealing member 11 and regions of the one main surface 3a of the support substrate 3 where the sealing member 11 is not bonded are supported by a support body 100 abutting the sealing member 11 and the regions.