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|1. (WO2018198544) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE|
|Applicants:||AOI ELECTRONICS CO.,LTD.
|Title:||METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE|
This method for manufacturing a semiconductor device is provided with: a step for disposing a solder layer on a connection terminal formed on one surface of a circuit board, said solder layer being formed on an end surface of a columnar electrode of a semiconductor element; a step for bonding the solder layer and the connection terminal to each other by applying ultrasonic waves; a step for sealing the semiconductor element using a thermosetting resin, and curing the thermosetting resin; and a step for, after curing the thermosetting resin, heating the solder layer to a temperature higher than the melting point of the solder layer, and bonding the solder layer and the connection terminal to each other.