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1. (WO2018198544) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/198544    International Application No.:    PCT/JP2018/008866
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Mar 08 00:59:59 CET 2018
IPC: H01L 21/60
H01L 21/56
H01L 21/607
H01L 23/12
Applicants: AOI ELECTRONICS CO.,LTD.
アオイ電子株式会社
Inventors: KOSUGI, Tomoyuki
小杉 智之
KONO, Ichiro
河野 一郎
WAKISAKA, Shinji
脇坂 伸治
Title: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Abstract:
This method for manufacturing a semiconductor device is provided with: a step for disposing a solder layer on a connection terminal formed on one surface of a circuit board, said solder layer being formed on an end surface of a columnar electrode of a semiconductor element; a step for bonding the solder layer and the connection terminal to each other by applying ultrasonic waves; a step for sealing the semiconductor element using a thermosetting resin, and curing the thermosetting resin; and a step for, after curing the thermosetting resin, heating the solder layer to a temperature higher than the melting point of the solder layer, and bonding the solder layer and the connection terminal to each other.