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1. (WO2018198455) JUNCTION STRUCTURE, METHOD FOR MANUFACTURING SAME, ELECTRIC MOTOR, AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2018/198455 International Application No.: PCT/JP2018/002517
Publication Date: 01.11.2018 International Filing Date: 26.01.2018
IPC:
B23K 35/28 (2006.01) ,B23K 1/00 (2006.01) ,B23K 1/19 (2006.01) ,C22C 18/04 (2006.01) ,H01L 21/52 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
28
with the principal constituent melting at less than 950°C
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
19
taking account of the properties of the materials to be soldered
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
18
Alloys based on zinc
04
with aluminium as the next major constituent
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
山▲崎▼ 浩次 YAMAZAKI, Koji; JP
加東 智明 KATO, Tomoaki; JP
Agent:
村上 加奈子 MURAKAMI, Kanako; JP
松井 重明 MATSUI, Jumei; JP
倉谷 泰孝 KURATANI, Yasutaka; JP
伊達 研郎 DATE, Kenro; JP
Priority Data:
2017-08991228.04.2017JP
Title (EN) JUNCTION STRUCTURE, METHOD FOR MANUFACTURING SAME, ELECTRIC MOTOR, AND METHOD FOR MANUFACTURING SAME
(FR) STRUCTURE DE JONCTION, SON PROCÉDÉ DE FABRICATION, MOTEUR ÉLECTRIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 接合構造体およびその製造方法並びに電動機およびその製造方法
Abstract:
(EN) This junction structure, which includes a Cu-based joined material (1) joined via a Zn-based brazing material (2), is provided with a junction part, including a first alloy phase (3), a second alloy phase (4), and a third alloy phase (5), between the Zn-based brazing material and the Cu-based joined material, wherein: the first alloy phase (3) is an alloy phase having a basic composition of Cu5Zn8; the third alloy phase (5) is an alloy phase, having a basic composition of CuZn4 or CuZn5, which is in partial contact with the first alloy phase; the second alloy phase 4 is an alloy phase having a basic composition of CuZn3 and formed on the interface between the first alloy phase and the third alloy phase; and in a cross-section parallel to the joining direction, the second alloy phase constitutes less than 80% of the interface between the first alloy phase and the third alloy phase. Thus, it is possible to obtain a junction structure which has high junction reliability and in which the formation of voids at the junction part of the Zn-based brazing material and the Cu-based joined material is suppressed.
(FR) Cette structure de jonction, qui comprend un matériau assemblé à base de Cu (1) lié par l'intermédiaire d'un matériau de brasage à base de Zn (2), est pourvue d'une partie de jonction, comprenant une première phase d'alliage (3), une deuxième phase d'alliage (4), et une troisième phase d'alliage (5), entre le matériau de brasage à base de Zn et le matériau assemblé à base de Cu, dans laquelle la première phase d'alliage (3) est une phase d'alliage ayant une composition basique de Cu5Zn8 ; la troisième phase d'alliage (5) est une phase d'alliage, ayant une composition de base de CuZn4 ou de CuZn5, qui est en contact partiel avec la première phase d'alliage ; la deuxième phase d'alliage 4 est une phase d'alliage ayant une composition basique de CuZn3 et formée à l'interface entre la première phase d'alliage et la troisième phase d'alliage ; et dans une section transversale parallèle à la direction d'assemblage, la deuxième phase d'alliage constitue moins de 80 % de l'interface entre la première phase d'alliage et la troisième phase d'alliage. Ainsi, il est possible d'obtenir une structure de jonction qui présente une fiabilité de jonction élevée et dans laquelle la formation de vides au niveau de la partie de jonction du matériau de brasage à base de Zn et du matériau de brasage à base de Cu est supprimée.
(JA) 接合構造体は、Zn系ロウ材(2)により接合されたCu系被接合材(1)を含む接合構造体であって、Zn系ロウ材とCu系被接合材との間に、第1の合金相(3)、第2の合金相(4)および第3の合金相(5)を含む接合部を備え、第1の合金相(3)はCuZnの基本組成を有する合金相であり、第3の合金相(5)は一部が第1の合金相と接するCuZnあるいはCuZnの基本組成を有する合金相であり、第2の合金相(4)は第1の合金相と第3の合金相との界面に形成されたCuZnの基本組成を有する合金相であり、接合方向に平行な断面において、前記第1の合金相と前記第3の合金相との界面における前記第2の合金相の占める割合が80%未満である。これにより、Zn系ロウ材とCu系被接合材との接合部における空隙の形成が抑制された接合信頼性の高い接合構造体を得ることができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)