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1. (WO2018198169) ELECTRONIC APPARATUS
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Pub. No.: WO/2018/198169 International Application No.: PCT/JP2017/016209
Publication Date: 01.11.2018 International Filing Date: 24.04.2017
IPC:
H05K 5/00 (2006.01) ,H01L 23/28 (2006.01) ,H01L 25/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
吉田 健太 YOSHIDA, Kenta; JP
Agent:
高村 順 TAKAMURA, Jun; JP
Priority Data:
Title (EN) ELECTRONIC APPARATUS
(FR) APPAREIL ÉLECTRONIQUE
(JA) 電子機器
Abstract:
(EN) This slave device (51) is provided with: a box-like case (1) the top surface (1a) of which is open; an electronic circuit (2) having a substrate (5) on which electronic components (6) are mounted, and contained inside the case (1); an insulating fluid (3) which exhibits insulating and fluid properties, and which is filled inside the case (1) and covers the electronic circuit (2); a lid (8) placed over the insulating fluid (3); and resin layers (4) which are provided in spaces between the lid (8) and side surfaces (1b) of the case (1), and close the top surface (1a) of the case (1) with the lid (8).
(FR) Ce dispositif esclave (51) est pourvu : d'un boîtier de type boîte (1) dont la surface supérieure (1a) est ouverte ; d'un circuit électronique (2) ayant un substrat (5) sur lesquels sont montés des composants électroniques (6), et contenu à l'intérieur du boîtier (1) ; d'un fluide isolant (3) qui présente des propriétés d'isolation et de fluide, et qui est rempli à l'intérieur du boîtier (1) et recouvre le circuit électronique (2) ; d'un couvercle (8) placé sur le fluide isolant (3) ; et de couches de résine (4) qui sont disposées dans des espaces entre le couvercle (8) et des surfaces latérales (1b) du boîtier (1), et ferment la surface supérieure (1a) du boîtier (1) avec le couvercle (8).
(JA) スレーブ装置(51)は、天面(1a)が開放された箱状のケース(1)と、電子部品(6)が実装された基板(5)を有し、ケース(1)内に収容された電子回路(2)と、絶縁性及び流動性を有し、ケース(1)内に充填されて電子回路(2)を覆う絶縁性流動体(3)と、絶縁性流動体(3)の上に載置された蓋(8)と、蓋(8)とケース(1)の側面(1b)との隙間に設けられて、蓋(8)とともにケース(1)の天面(1a)を塞ぐ樹脂層(4)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)