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1. (WO2018197836) MEMS DEVICE AND PROCESS
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Pub. No.: WO/2018/197836 International Application No.: PCT/GB2018/050982
Publication Date: 01.11.2018 International Filing Date: 13.04.2018
IPC:
H04R 19/00 (2006.01) ,H04R 31/00 (2006.01) ,H04R 19/04 (2006.01) ,B81B 7/00 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19
Electrostatic transducers
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31
Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19
Electrostatic transducers
04
Microphones
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
7
Micro-structural systems
Applicants:
CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED [GB/GB]; 7B Nightingale Way, Quartermile Edinburgh Lothian EH3 9EG, GB
Inventors:
PIECHOCINSKI, Marek, Sebastian; GB
BRIOSCHI, Roberto; US
ACHEHBOUNE, Rkia; GB
Agent:
COOPER-ROLFE, Elizabeth; GB
Priority Data:
1708347.825.05.2017GB
62/491,48028.04.2017US
Title (EN) MEMS DEVICE AND PROCESS
(FR) DISPOSITIF MEMS ET PROCÉDÉ
Abstract:
(EN) The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.
(FR) La présente invention concerne des techniques permettant de modifier la mouillabilité d'époxy d'une surface d'un dispositif MEMS. En particulier, l'invention concerne des agencements de liaison à puce retournée dans lesquels une surface supérieure d'un dispositif MEMS est collée à un substrat de boîtier. Une région barrière est disposée sur une surface supérieure du dispositif MEMS, latéralement à l'extérieur d'une région qui forme ou recouvre la plaque arrière et/ou la cavité dans le substrat de transducteur. La région barrière comprend une pluralité de discontinuités, par exemple des alvéoles, qui inhibent l'écoulement d'époxy.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)