Search International and National Patent Collections

1. (WO2018197390) SOLDER PREFORM FOR ESTABLISHING A DIFFUSION SOLDER CONNECTION AND METHOD FOR PRODUCING A SOLDER PREFORM

Pub. No.:    WO/2018/197390    International Application No.:    PCT/EP2018/060296
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Tue Apr 24 01:59:59 CEST 2018
IPC: B23K 35/26
B23K 35/30
B23K 35/02
H01L 23/00
Applicants: SIEMENS AKTIENGESELLSCHAFT
Inventors: SCHELLENBERG, Christian
STROGIES, Jörg
WILKE, Klaus
Title: SOLDER PREFORM FOR ESTABLISHING A DIFFUSION SOLDER CONNECTION AND METHOD FOR PRODUCING A SOLDER PREFORM
Abstract:
The invention relates to a solder preform for establishing a diffusion solder connection. The solder preform (11) has a solder material (20), which also forms the joining surfaces (12, 13) of the solder preform (11). The invention provides for the solder preform to have a further phase (18) for example in the form of particles, of which the material diffuses into the solder material (20) and thus forms a diffusion zone (19). The invention provides for this diffusion operation to be initiated in the solder preform during production of the latter (for example 1 by way of a heat treatment), as a result of which a diffusion solder connection forms more quickly when the solder preform (11) is subsequently soldered. Moreover, the diffusion zone (19), which may be formed by an intermetallic compound, stabilizes the solder preform while the solder material (20) is being liquefied. The invention nevertheless provides for the solder material still to be available at the joining surfaces (12, 13), in order for the solder connection to adjacent joining partners to be formed. The invention also relates to a method for producing such a solder preform.