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1. (WO2018197379) NEGATIVE RESIST FORMULATION FOR PRODUCING UNDERCUT PATTERN PROFILES

Pub. No.:    WO/2018/197379    International Application No.:    PCT/EP2018/060272
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Tue Apr 24 01:59:59 CEST 2018
IPC: G03F 7/038
Applicants: MERCK PATENT GMBH
Inventors: MUKHERJEE, Anupama
TOUKHY, Medhat A.
Title: NEGATIVE RESIST FORMULATION FOR PRODUCING UNDERCUT PATTERN PROFILES
Abstract:
A negative-acting, photoresist composition, imageable by 365 nm radiation that is developable in aqueous base. Apart from solvent, this composition comprises: a) an aqueous base soluble phenolic film-forming polymeric binder resin having ring bonded hydroxyl groups; b) a photoacid generator c) a crosslinking agent which comprises an etherified melamine; d) a dye as described herein; e) a quencher system consisting essentially of an amine quencher, or a mixture of such amine quenchers, as described. This invention also pertains to processes of using this composition as a photoresist.