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1. (WO2018197143) METHOD AND APPARATUS FOR OPTIMIZATION OF LITHOGRAPHIC PROCESS
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Pub. No.: WO/2018/197143 International Application No.: PCT/EP2018/057926
Publication Date: 01.11.2018 International Filing Date: 28.03.2018
IPC:
G03F 7/20 (2006.01) ,G05B 19/418 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
05
CONTROLLING; REGULATING
B
CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19
Programme-control systems
02
electric
418
Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control (DNC), flexible manufacturing systems (FMS), integrated manufacturing systems (IMS), computer integrated manufacturing (CIM)
Applicants:
ASML NETHERLANDS B.V. [NL/NL]; P.O. Box 324 5500 AH Veldhoven, NL
Inventors:
HAUPTMANN, Marc; NL
MOS, Everhardus, Cornelis; NL
KOU, Weitian; NL
YPMA, Alexander; NL
KUPERS, Michiel; NL
YU, Hyun-Woo; NL
HAN, Min-Sub; NL
Agent:
PETERS, John; NL
Priority Data:
17168801.328.04.2017EP
Title (EN) METHOD AND APPARATUS FOR OPTIMIZATION OF LITHOGRAPHIC PROCESS
(FR) PROCÉDÉ ET APPAREIL D'OPTIMISATION DE PROCESSUS LITHOGRAPHIQUE
Abstract:
(EN) A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
(FR) La présente invention concerne un procédé lithographique qui est réalisé sur un ensemble de substrats semi-conducteurs se composant d'une pluralité de substrats. Dans le cadre du processus, l'ensemble de substrats est divisé en un certain nombre de sous-ensembles. La division peut être basée sur un ensemble de caractéristiques associées à une première couche sur les substrats. Une empreinte d'un paramètre de performance est ensuite déterminée pour au moins un substrat parmi l'ensemble de substrats. Dans certaines circonstances, l'empreinte est déterminée pour un substrat de chaque sous-ensemble de substrats. L'empreinte est associée à au moins la première couche. Une correction du paramètre de performance associé à une application d'une couche ultérieure est ensuite dérivée, la dérivation étant basée sur l'empreinte déterminée et la division de l'ensemble de substrats.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)