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1. (WO2018196838) SILICON WAFER PROCESSING DEVICE AND METHOD
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Pub. No.: WO/2018/196838 International Application No.: PCT/CN2018/084774
Publication Date: 01.11.2018 International Filing Date: 27.04.2018
IPC:
H01L 21/67 (2006.01) ,G03F 7/20 (2006.01) ,G03F 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9
Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Applicants:
上海微电子装备(集团)股份有限公司 SHANGHAI MICRO ELECTRONICS EQUIPMENT(GROUP) CO., LTD. [CN/CN]; 中国上海市 张江高科技园区张东路1525号 1525 Zhangdong Road, Zhangjiang High-Tech Park Shanghai 201203, CN
Inventors:
王刚 WANG, Gang; CN
施益超 SHI, Yichao; CN
姜杰 JIANG, Jie; CN
黄栋梁 HUANG, Dongliang; CN
宋海军 SONG, Haijun; CN
Agent:
上海思微知识产权代理事务所(普通合伙) SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY; 中国上海市 长宁区天山西路789号1幢341室 Room 341, Building 1 789 West Tianshan Road, Changning District Shanghai 200335, CN
Priority Data:
201710294642.028.04.2017CN
Title (EN) SILICON WAFER PROCESSING DEVICE AND METHOD
(FR) DISPOSITIF DE TRAITEMENT DE TRANCHE DE SILICIUM ET PROCÉDÉ
(ZH) 硅片处理装置及方法
Abstract:
(EN) Disclosed is a silicon wafer processing device; a pre-aligned optical assembly (3) and an edge exposure assembly (5) are provided on a synchronous bi-directional motion module (4), reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit (7) and a position compensation unit (8) on a bottom plate (1) are controlled by means of a control assembly (2), so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers (9) of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.
(FR) L'invention concerne un dispositif de traitement de tranche de silicium; un ensemble optique pré-aligné (3) et un ensemble d'exposition de bord (5) sont disposés sur un module de mouvement bidirectionnel synchrone (4), réduisant l'espace occupé du dispositif et économisant le coût d'installation; et en outre, un module de mouvement bidirectionnel synchrone, une unité de rotation (7) et une unité de compensation de position (8) sur une plaque inférieure (1) sont commandés au moyen d'un ensemble de commande (2), de façon à réduire la complexité de fonctionnement; et en outre, le module de mouvement bidirectionnel synchrone est commandé pour amener l'ensemble optique pré-aligné et l'ensemble d'exposition de bord à se déplacer simultanément, de sorte que les opérations de pré-alignement et d'exposition de bord peuvent être réalisées sur des tranches de silicium (9) de tailles différentes, ce qui permet d'économiser le temps de commutation et d'augmenter l'efficacité de fonctionnement. L'invention concerne en outre un procédé de traitement d'une tranche de silicium à l'aide d'un dispositif de traitement de tranche de silicium.
(ZH) 一种硅片处理装置,将预对准光机组件(3)及边缘曝光组件(5)设于同步双向运动模组(4)上,降低了装置的占用空间,节约了安装成本;进一步,通过控制组件(2)控制底板(1)上的同步双向运动模组、旋转单元(7)以及位置补偿单元(8),降低了操作复杂度;进一步,通过控制同步双向运动模组以驱动预对准光机组件及边缘曝光组件同时运动,可对不同尺寸的硅片(9)进行预对准及边缘曝光操作,节省了切换时间,提高了工作效率。还公开了一种使用硅片处理装置进行硅片处理的方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)