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1. (WO2018196466) METHOD AND DEVICE FOR MEASURING MECHANICAL PARAMETER OF MULTI-LAYER COMPOSITE THIN FILM STRUCTURE

Pub. No.:    WO/2018/196466    International Application No.:    PCT/CN2018/076248
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Mon Feb 12 00:59:59 CET 2018
IPC: G01N 3/00
Applicants: SOUTHEAST UNIVERSITY
东南大学
Inventors: ZHOU, Zaifa
周再发
SUN, Chao
孙超
GUO, Xinge
郭欣格
HUANG, Qingan
黄庆安
Title: METHOD AND DEVICE FOR MEASURING MECHANICAL PARAMETER OF MULTI-LAYER COMPOSITE THIN FILM STRUCTURE
Abstract:
Provided are a method for measuring a mechanical parameter of a multi-layer composite thin film structure, and a device for measuring a mechanical parameter of a multi-layer composite thin film structure, which fall within the technical field of the online testing of material parameters of a micro-electro-mechanical system (MEMS for short). By means of the method, based on the relationship between a first-order resonance frequency of a multi-layer composite clamped-clamped beam and a multi-layer composite cantilever beam and parameters such as a material characteristic and a structure size, an equivalent Young's modulus of each layer of a multi-layer composite thin film structure and an equivalent residual stress of each layer are obtained in one step by means of solving a set of equations, which can satisfy the online testing of a multi-layer thin film material, has a simple test structure and calculation method, and has a higher accuracy.