Search International and National Patent Collections

1. (WO2018196410) COOLING APPARATUS, HEAT SINK, ELECTRONIC DEVICE, AND METHOD FOR COOLING CONTROL

Pub. No.:    WO/2018/196410    International Application No.:    PCT/CN2017/117751
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Fri Dec 22 00:59:59 CET 2017
IPC: H01L 23/36
H05K 7/20
Applicants: HUAWEI TECHNOLOGIES CO., LTD.
华为技术有限公司
Inventors: DONG, Ying
董英
HU, Weifeng
胡卫峰
LI, Binghua
李炳华
ZHOU, Jibin
周吉彬
Title: COOLING APPARATUS, HEAT SINK, ELECTRONIC DEVICE, AND METHOD FOR COOLING CONTROL
Abstract:
A cooling apparatus comprising: an adjustable cooling component (10), a fixed substrate (201), a rotating shaft (30), and a connecting component (40). An electronic component (50) is provided at one side of the adjustable cooling component (10); the rotating shaft (30) is provided at the other side of the adjustable cooling component (10). One extremity of the connecting component (40) is connected to the adjustable cooling component (10); the other extremity of the connecting component (40) is connected to the fixed substrate (201); and the connecting component (40) drives the adjustable cooling component (10) to rotate via the rotating shaft (30). A heat sink, the electronic device, and a method for cooling control, with the goal of having the electronic component (50) and the adjustable cooling component (10) rotating at the same time implemented by means of adjusting the connecting component (40), and without affecting cooling effects, the complexity of deploying the electronic component and the cooling apparatus is reduced, thus favoring enhanced convenience of operation.