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|1. (WO2018196327) HEATING APPARATUS|
|Applicants:||BOE TECHNOLOGY GROUP CO., LTD.
Disclosed is a heating apparatus (100) for heating an OLED substrate, the heating apparatus comprising a heating plate (101), a support member (102) and a temperature controller (104), wherein the temperature controller is connected to the heating plate and the support member respectively, and the temperature controller is used for heating the heating plate and the support member synchronously, so that the temperature of the heating plate and that of the support member are approximately the same; the heating plate comprises an accommodation portion (103) used for accommodating the support member; and the support member is configured to stretch out of the heating plate and retract into the heating plate. The heating plate and the support member are provided with approximately the same temperature, reducing the temperature difference between a heating plate area and a support member area, increasing the evaporation uniformity of a film solvent, and improving the homogeneity of the film thickness after thermofixation is performed.