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1. (WO2018196327) HEATING APPARATUS

Pub. No.:    WO/2018/196327    International Application No.:    PCT/CN2017/109910
Publication Date: Fri Nov 02 00:59:59 CET 2018 International Filing Date: Thu Nov 09 00:59:59 CET 2017
IPC: H01L 51/56
Applicants: BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
Inventors: ZHOU, Bin
周斌
YUAN, Guangcai
袁广才
WANG, Dongfang
王东方
ZHAO, Ce
赵策
CHENG, Jun
成军
DING, Luke
丁录科
Title: HEATING APPARATUS
Abstract:
Disclosed is a heating apparatus (100) for heating an OLED substrate, the heating apparatus comprising a heating plate (101), a support member (102) and a temperature controller (104), wherein the temperature controller is connected to the heating plate and the support member respectively, and the temperature controller is used for heating the heating plate and the support member synchronously, so that the temperature of the heating plate and that of the support member are approximately the same; the heating plate comprises an accommodation portion (103) used for accommodating the support member; and the support member is configured to stretch out of the heating plate and retract into the heating plate. The heating plate and the support member are provided with approximately the same temperature, reducing the temperature difference between a heating plate area and a support member area, increasing the evaporation uniformity of a film solvent, and improving the homogeneity of the film thickness after thermofixation is performed.