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1. (WO2018194123) RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMATION METHOD
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/194123 International Application No.: PCT/JP2018/016125
Publication Date: 25.10.2018 International Filing Date: 19.04.2018
IPC:
G03F 7/004 (2006.01) ,C08F 220/18 (2006.01) ,G03F 7/038 (2006.01) ,G03F 7/039 (2006.01) ,G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
220
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
02
Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10
Esters
12
of monohydric alcohols or phenols
16
of phenols or of alcohols containing two or more carbon atoms
18
with acrylic or methacrylic acids
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
JSR株式会社 JSR CORPORATION [JP/JP]; 東京都港区東新橋一丁目9番2号 9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo 1058640, JP
Inventors:
古市 康太 FURUICHI Kouta; JP
岡嵜 聡司 OKAZAKI Satoshi; JP
Agent:
天野 一規 AMANO Kazunori; JP
Priority Data:
2017-08377120.04.2017JP
Title (EN) RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMATION METHOD
(FR) COMPOSITION DE RÉSINE SENSIBLE AU RAYONNEMENT ET PROCÉDÉ DE FORMATION DE MOTIF DE RÉSERVE
(JA) 感放射線性樹脂組成物及びレジストパターン形成方法
Abstract:
(EN) The present invention is a radiation-sensitive resin composition containing a first polymer having structural units including an acid-dissociable group, a first compound generated by radiating radioactive rays onto a first acid that dissociates the acid-dissociable group in one minute at 110ºC, and a second compound generated by radiating radioactive rays onto a second acid that does not substantially dissociate the acid-dissociable group in one minute at 110ºC, the first compound content being at least 10% by mass of the total solid content (all non-solvent components in the composition), and the ratio Bm/Cm being at least 1.7, where Bm is the number of moles of the first compound and Cm is the number of moles of the second compound.
(FR) La présente invention concerne une composition de résine sensible au rayonnement contenant un premier polymère ayant des unités structurales comprenant un groupe dissociable par un acide, un premier composé généré par rayonnement de rayons radioactifs sur un premier acide qui dissocie le groupe dissociable par un acide en une minute à 110 °C et un second composé généré par rayonnement de rayons radioactifs sur un second acide qui ne dissocie pas sensiblement le groupe dissociable par un acide en une minute à 110 °C, la teneur en premier composé représentant au moins 10 % en masse de la teneur totale en solides (tous les composants autres que le solvant dans la composition) et le rapport Bm/Cm étant d'au moins 1,7, où Bm est le nombre de moles du premier composé et Cm est le nombre de moles du second composé.
(JA) 本発明は、酸解離性基を含む構造単位を有する第1重合体と、上記酸解離性基を110℃、1分の条件で解離させる第1酸を放射線の照射により発生する第1化合物と、上記酸解離性基を110℃、1分の条件で実質的に解離させない第2酸を放射線の照射により発生する第2化合物とを含有し、上記第1化合物の含有量が全固形分(組成物中の溶媒以外の全成分)中10質量%以上であり、上記第1化合物のモル数をB、上記第2化合物のモル数をCとした場合に、B/Cが1.7以上である感放射線性樹脂組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)