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1. (WO2018193850) CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/193850 International Application No.: PCT/JP2018/014455
Publication Date: 25.10.2018 International Filing Date: 04.04.2018
IPC:
C08F 212/34 (2006.01) ,C08F 222/40 (2006.01) ,C08L 61/06 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
212
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
34
Monomers containing two or more unsaturated aliphatic radicals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
222
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
36
Amides or imides
40
Imides, e.g. cyclic imides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61
Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
04
Condensation polymers of aldehydes or ketones with phenols only
06
of aldehydes with phenols
Applicants:
昭和電工株式会社 SHOWA DENKO K.K. [JP/JP]; 東京都港区芝大門1丁目13番9号 13-9, Shiba Daimon 1-chome, Minato-ku, Tokyo 1058518, JP
Inventors:
長谷川 葵 HASEGAWA, AOI; JP
石橋 圭孝 ISHIBASHI, Yoshitaka; JP
Agent:
青木 篤 AOKI, Atsushi; JP
三橋 真二 MITSUHASHI, Shinji; JP
高橋 正俊 TAKAHASHI, Masatoshi; JP
胡田 尚則 EBISUDA, Hisanori; JP
河原 肇 KAWAHARA, Hajime; JP
Priority Data:
2017-08270119.04.2017JP
Title (EN) CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF
(FR) COMPOSITION DE RÉSINE DURCISSABLE, OBJET DURCI ASSOCIÉ, ET STRUCTURE CONTENANT CELLE-CI
(JA) 硬化性樹脂組成物、その硬化物、及びその硬化物を含む構造体
Abstract:
(EN) Provided is a curable resin composition by which a cured product having an excellent heat resistance and flame retardancy can be obtained through curing. The curable resin composition includes: (A) a polyalkenyl phenol compound having at least two structural units represented by formula 1(a); and (B) a polymaleimide compound (in the formula, R1-R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxyl group, and Y1 represents an alkenyl group).
(FR) L’invention fournit une composition de résine durcissable qui permet d’obtenir par durcissement un objet durci d’une résistance à la chaleur ainsi que d’une résistance à la flamme qui sont excellentes. Plus précisément, l’invention concerne une composition de résine durcissable qui contient un composé polyalcénylphénol (A) possédant au moins deux unités structurales représentées par la formule (1(a)), et un composé polymaléimide (B). (Dans la formule, R à R représentent chacun indépendamment un atome d’hydrogène, un groupe alkyle de 1 à 10 atomes de carbone, un groupe alkoxy de 1 à 2 atomes de carbone, un groupe alcényle de 2 à 6 atomes de carbone ou un groupe hydroxyle, et Y représente un groupe alcényle.)
(JA) 硬化することにより耐熱性及び難燃性に優れた硬化物を得ることができる硬化性樹脂組成物を提供する。 式1(a)で表される構造単位を少なくとも2つ有するポリアルケニルフェノール化合物(A)、及びポリマレイミド化合物(B)を含む硬化性樹脂組成物。 (式中、R~Rはそれぞれ独立に水素原子、炭素数1~10のアルキル基、炭素数1~2のアルコキシ基、炭素数2~6のアルケニル基又は水酸基を表し、Yはアルケニル基を表す。)
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020190084126