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1. (WO2018193844) MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/RECEPTION MODULE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/193844 International Application No.: PCT/JP2018/014416
Publication Date: 25.10.2018 International Filing Date: 04.04.2018
IPC:
H05K 1/02 (2006.01) ,H01Q 1/38 (2006.01) ,H01Q 21/08 (2006.01) ,H01Q 23/00 (2006.01) ,H05K 3/46 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
21
Aerial arrays or systems
06
Arrays of individually energised aerial units similarly polarised and spaced apart
08
the units being spaced along, or adjacent to, a rectilinear path
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
23
Aerials with active circuits or circuit elements integrated within them or attached to them
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社フジクラ FUJIKURA LTD. [JP/JP]; 東京都江東区木場1丁目5番1号 1-5-1, Kiba, Koto-ku, Tokyo 1358512, JP
Inventors:
和田 英之 WADA, Hideyuki; JP
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2017-08113617.04.2017JP
Title (EN) MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/RECEPTION MODULE
(FR) SUBSTRAT MULTICOUCHE, RÉSEAU DE SUBSTRATS MULTICOUCHES ET MODULE D'ÉMISSION/RÉCEPTION
(JA) 多層基板、多層基板アレイ、及び送受信モジュール
Abstract:
(EN) The present invention realizes a multilayer substrate and a multilayer substrate array that allow a high degree of freedom in manufacturing thereof. In a multilayer substrate (100) that has wiring provided in an inner layer, at least a part of the perimeter (51) thereof is formed to have a wave shape.
(FR) La présente invention concerne un substrat multicouche et un réseau de substrats multicouches qui permettent un degré élevé de liberté dans leur fabrication. Dans un substrat multicouche (100) qui a un câblage disposé dans une couche interne, au moins une partie du périmètre (51) de celui-ci est formée pour avoir une forme d'onde.
(JA) 製造方法における自由度が高い多層基板、及び多層基板アレイを実現する。内層に配線が設けられた多層基板(100)は、その外周(51)の少なくとも一部が波形に加工されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)