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1. (WO2018190089) CLEANING WATER SUPPLY DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/190089 International Application No.: PCT/JP2018/011100
Publication Date: 18.10.2018 International Filing Date: 20.03.2018
IPC:
H01L 21/304 (2006.01) ,C02F 1/42 (2006.01) ,C02F 1/58 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
C CHEMISTRY; METALLURGY
02
TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
F
TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1
Treatment of water, waste water, or sewage
42
by ion-exchange
C CHEMISTRY; METALLURGY
02
TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
F
TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1
Treatment of water, waste water, or sewage
58
by removing specified dissolved compounds
Applicants:
栗田工業株式会社 KURITA WATER INDUSTRIES LTD. [JP/JP]; 東京都中野区中野四丁目10番1号 10-1, Nakano 4-chome, Nakano-ku, Tokyo 1640001, JP
Inventors:
森田 博志 MORITA, Hiroshi; JP
顔 暢子 GAN, Nobuko; JP
Agent:
重野 剛 SHIGENO, Tsuyoshi; JP
重野 隆之 SHIGENO, Takayuki; JP
Priority Data:
2017-08062614.04.2017JP
Title (EN) CLEANING WATER SUPPLY DEVICE
(FR) SYSTÈME D'ALIMENTATION EN EAU DE NETTOYAGE
(JA) 洗浄水供給装置
Abstract:
(EN) This cleaning water supply device is provided with: an ultrapure water line 1 through which a fixed amount of ultrapure water flows; a production unit 2 which adds a fixed amount of a solute into the ultrapure water line to produce a cleaning water; a cleaning water line 3 through which the cleaning water flows; cleaning machines 5A-5N to which the cleaning water is supplied from the cleaning water line 3; a solute removal unit 4 into which surplus cleaning water is introduced from the cleaning water line 3; and a recovery line 6 for returning, to a tank or the like, recovered water from which the solute has been removed.
(FR) La présente invention concerne un dispositif d'alimentation en eau de nettoyage pourvu : d'une conduite d'eau ultra-pure 1 à travers laquelle s'écoule une quantité fixe d'eau ultra-pure ; d'une unité de production 2 qui ajoute une quantité fixe d'un soluté dans la conduite d'eau ultra-pure afin de produire une eau de nettoyage ; d'une conduite d'eau de nettoyage 3 à travers laquelle s'écoule l'eau de nettoyage ; de machines de nettoyage 5A-5N auxquelles l'eau de nettoyage est fournie par la conduite d'eau de nettoyage 3 ; d'une unité d'élimination de soluté 4 dans laquelle de l'eau de nettoyage excédentaire est introduite à partir de la conduite d'eau de nettoyage 3 ; et d'une conduite de récupération 6 servant à renvoyer, vers un réservoir, ou analogue, l'eau récupérée de laquelle a été éliminé le soluté.
(JA) 洗浄水供給装置は、超純水が定量にて流れる超純水ライン1と、該超純水ラインに溶質を定量添加して洗浄水を製造する製造部2と、洗浄水を流すための洗浄水ライン3と、該洗浄水ライン3から洗浄水が供給される洗浄機5A~5Nと、余剰の洗浄水が洗浄水ライン3から導入される溶質除去部4と、溶質が除去された回収水をタンク等へ戻すための回収ライン6を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)