Search International and National Patent Collections

1. (WO2018185876) COMPONENT MOUNTING DEVICE, COMPONENT RECOGNITION METHOD, APPEARANCE INSPECTION DEVICE, AND APPEARANCE INSPECTION METHOD

Pub. No.:    WO/2018/185876    International Application No.:    PCT/JP2017/014225
Publication Date: Fri Oct 12 01:59:59 CEST 2018 International Filing Date: Thu Apr 06 01:59:59 CEST 2017
IPC: G01B 11/24
G06T 1/00
H05K 13/08
Applicants: YAMAHA HATSUDOKI KABUSHIKI KAISHA
ヤマハ発動機株式会社
Inventors: SUZUKI, Mamoru
鈴木 守
Title: COMPONENT MOUNTING DEVICE, COMPONENT RECOGNITION METHOD, APPEARANCE INSPECTION DEVICE, AND APPEARANCE INSPECTION METHOD
Abstract:
The present invention uses a recognition camera 5 to repeatedly capture one-dimensional images of image-capturing ranges Rb, Rc, respectively, by imaging light from the image-capturing ranges Rb, Rc on an image-capturing element 51 by means of a lens 52, while moving a component C (solder S) to the recognition camera 5, and captures two-dimensional images of the component C (solder S). In addition, since the lens 52 of the recognition camera 5 is non-telecentric on an object side, three-dimensional information on the component C (solder S) can be obtained on the basis of the two-dimensional images. In this way, two images viewed from different angles can be captured with one recognition camera 5, and the three-dimensional information on the component C (solder S) can be obtained. As a result, it is possible to suppress cost increase and conveniently acquire the three-dimensional information on the component C (solder S) with high accuracy.