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1. (WO2018185859) PROTECTIVE STRUCTURE OF SEMICONDUCTOR ELEMENT AND AIR CONDITIONER

Pub. No.:    WO/2018/185859    International Application No.:    PCT/JP2017/014148
Publication Date: Fri Oct 12 01:59:59 CEST 2018 International Filing Date: Wed Apr 05 01:59:59 CEST 2017
IPC: H01L 23/32
F24F 1/22
F24F 1/24
H01L 23/12
H01L 23/40
H05K 1/02
H05K 1/18
H05K 7/20
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: SAKURAI, Kenta
櫻井 建太
Title: PROTECTIVE STRUCTURE OF SEMICONDUCTOR ELEMENT AND AIR CONDITIONER
Abstract:
Provided is a protective structure of a semiconductor element, comprising: a circuit substrate (6); a spacer (9) disposed on a first surface of the circuit substrate (6); a semiconductor element disposed on the spacer (9); a heat dissipation body (5) that is disposed on the semiconductor element and in regions on the spacer (9) other than where the semiconductor element is disposed, the heat dissipation body (5) being in contact with a non-substrate-facing surface of the element, such surface opposite the surface of the semiconductor element facing the circuit substrate (6); and screws (11) that screw and hold in place the circuit substrate (6), the spacer (9), and the heat dissipation body (5), within a plane of a substrate-facing spacer surface (9d) of the spacer (9), such surface facing the circuit substrate (6), and in regions other than where the semiconductor element is disposed.