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1. (WO2018185373) METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY AND AN ELECTRONIC ASSEMBLY

Pub. No.:    WO/2018/185373    International Application No.:    PCT/FI2018/050243
Publication Date: Fri Oct 12 01:59:59 CEST 2018 International Filing Date: Fri Apr 06 01:59:59 CEST 2018
IPC: B29C 45/16
B29L 31/34
Applicants: TACTOTEK OY
Inventors: ISOHÄTÄLÄ, Anne
SINIVAARA, Hasse
HEIKKINEN, Mikko
Title: METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY AND AN ELECTRONIC ASSEMBLY
Abstract:
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.