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1. (WO2018184595) HEAT DISSIPATION DEVICES
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Pub. No.: WO/2018/184595 International Application No.: PCT/CN2018/082186
Publication Date: 11.10.2018 International Filing Date: 08.04.2018
IPC:
H05K 1/02 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
TIANJIN LAIRD TECHNOLOGIES LIMITED [CN/CN]; Building C3 & C4, HongTai Industry Park, No.87 TaiFeng Road, TEDA Tianjin 300457, CN
Inventors:
ZHAO, Daniel; CN
SHEN, Jingbo; CN
LIN, Xuefeng; CN
ZHOU, Jie; CN
Agent:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD.; 16th Fl., Block A, Corporate Square, No.35 Jinrong Street Beijing 100033, CN
Priority Data:
201710468419.320.06.2017CN
201720359504.107.04.2017CN
201720716615.320.06.2017CN
Title (EN) HEAT DISSIPATION DEVICES
(FR) DISPOSITIFS DE DISSIPATION DE CHALEUR
Abstract:
(EN) In an exemplary embodiment, a heat dissipation device is configured to dissipate heat from electronic components on a printed circuit board. The heat dissipation device generally includes a support mechanism comprising a main body and a connecting portion along an edge of the main body. The main body and the connecting portion form an internal space for accommodating the electronic components. The main body includes opposite first and second surfaces. The first surface faces the electronic component when the support mechanism is connected to the printed circuit board through the connecting portion. A first heat transfer member is disposed on the first surface. When the support mechanism is connected with the printed circuit board through the connecting portion, the first heat transfer member may be in contact with the one or more components and have a thickness of about 2 mils to about 15 mils.
(FR) La présente invention concerne, selon un mode de réalisation donné à titre d'exemple, un dispositif de dissipation de chaleur conçu pour dissiper la chaleur provenant de composants électroniques sur une carte de circuit imprimé. Le dispositif de dissipation de chaleur comprend généralement un mécanisme de support comprenant un corps principal et une partie de raccordement le long d'un bord du corps principal. Le corps principal et la partie de raccordement forment un espace interne pour recevoir les composants électroniques. Le corps principal comprend des première et seconde surfaces opposées. La première surface fait face au composant électronique lorsque le mécanisme de support est relié à la carte de circuit imprimé par l'intermédiaire de la partie de raccordement. Un premier élément de transfert de chaleur est disposé sur la première surface. Lorsque le mécanisme de support est relié à la carte de circuit imprimé par l'intermédiaire de la partie de raccordement, le premier élément de transfert de chaleur peut être en contact avec lesdits composants et avoir une épaisseur d'environ 2 mils à environ 15 mils.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)