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|1. (WO2018183755) MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING|
|Applicants:||LAM RESEARCH CORPORATION
BROGAN, Lee J.
SPURLIN, Tighe A.
REID, Jonathan David
BERRY, Clifford Raymond
|Title:||MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING|
Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.