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1. (WO2018183755) MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

Pub. No.:    WO/2018/183755    International Application No.:    PCT/US2018/025265
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01L 21/66
H01L 21/288
Applicants: LAM RESEARCH CORPORATION
Inventors: HUANG, Ludan
BROGAN, Lee J.
SPURLIN, Tighe A.
GHONGADI, Shantinath
REID, Jonathan David
RANJAN, Manish
PENNINGTON, Bryan
BERRY, Clifford Raymond
Title: MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
Abstract:
Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.