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1. (WO2018183739) INTERFACE STRUCTURES AND METHODS FOR FORMING SAME

Pub. No.:    WO/2018/183739    International Application No.:    PCT/US2018/025241
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01P 1/203
H01P 1/208
Applicants: INVENSAS BONDING TECHNOLOGIES, INC.
Inventors: HUANG, Shaowu
HABA, Belgacem
DELACRUZ, Javier A.
Title: INTERFACE STRUCTURES AND METHODS FOR FORMING SAME
Abstract:
A stacked and electrically interconnected structure is disclosed. The structure can comprise a first element and a second element directly bonded to the first element along a bonding interface without an intervening adhesive. A filter circuit can be integrally formed between the first and second elements along the bonding interface.