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1. (WO2018183309) PRODUCTION OF VERY SMALL OR THIN DIES

Pub. No.:    WO/2018/183309    International Application No.:    PCT/US2018/024541
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Wed Mar 28 01:59:59 CEST 2018
IPC: H01L 21/02
H01L 21/301
H01L 21/304
H01L 21/67
H01L 21/683
H01L 21/77
H01L 21/78
C09J 7/20
C09J 7/30
Applicants: SRI INTERNATIONAL
Inventors: CHAN, Winston, K.
MICHALCHUK, Joey, J.
Title: PRODUCTION OF VERY SMALL OR THIN DIES
Abstract:
A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive- adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.