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1. (WO2018182967) ADVANCED OPTICAL SENSOR, SYSTEM, AND METHODOLOGIES FOR ETCH PROCESSING MONITORING

Pub. No.:    WO/2018/182967    International Application No.:    PCT/US2018/022209
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Wed Mar 14 00:59:59 CET 2018
IPC: H01L 21/67
H01L 21/3065
H01L 21/66
Applicants: TOKYO ELECTRON LIMITED
TUITJE, Holger
TIAN, Xinkang
MENG, Ching-ling
VUONG, Vi
JIN, Wen
YAN, Zheng
MIHAYLOV, Mihail
Inventors: TUITJE, Holger
TIAN, Xinkang
MENG, Ching-ling
VUONG, Vi
JIN, Wen
YAN, Zheng
MIHAYLOV, Mihail
Title: ADVANCED OPTICAL SENSOR, SYSTEM, AND METHODOLOGIES FOR ETCH PROCESSING MONITORING
Abstract:
An apparatus, system, and method for in-situ etching monitoring in a plasma processing chamber. The apparatus includes a continuous wave broadband light source; an illumination system configured to illuminate an area on a substrate with an incident light beam having a fixed polarization direction, the incident light beam from the broadband light source being modulated by a shutter; a collection system configured to collect a reflected light beam being reflected from the illuminated area on the substrate, and direct the reflected light beam to a detector; and processing circuitry. The processing circuitry is configured to process the reflected light beam to suppress background light, determine a property value from the processed light, and control an etch process based on the determined property value.