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1. (WO2018182810) THERMAL ISOLATION OF CRYO-COOLED COMPONENTS FROM CIRCUIT BOARDS OR OTHER STRUCTURES

Pub. No.:    WO/2018/182810    International Application No.:    PCT/US2017/068254
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Dec 23 00:59:59 CET 2017
IPC: H05K 7/20
Applicants: RAYTHEON COMPANY
Inventors: CHOW, James R.
CONRAD, Theodore J.
LIN, Stephanie
ROSS, Richard C.
TAYRANI, Reza
Title: THERMAL ISOLATION OF CRYO-COOLED COMPONENTS FROM CIRCUIT BOARDS OR OTHER STRUCTURES
Abstract:
An apparatus (100) includes a substrate (104) having a recess (106) and a first insulator (108) submerged in the recess of the substrate. The apparatus also includes a cover (114) having a second insulator (116) that, together with the first insulator, defines an insulated volume. The apparatus further includes one or more components (102) to be cooled located over the first insulator and within the insulated volume. The apparatus could also include one or more electrical conductors (110) located over the first insulator, where at least one of the one or more components is electrically connected to the one or more electrical conductors. The one or more electrical conductors could be submerged in the recess of the substrate. The one or more electrical conductors could be thermally-insulative at cryogenic temperatures and could include carbon nanotubes. The first and second insulators could include foam or aerogel insulation.