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1. (WO2018182754) VERTICAL AND LATERAL INTERCONNECTS BETWEEN DIES

Pub. No.:    WO/2018/182754    International Application No.:    PCT/US2017/025654
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sun Apr 02 01:59:59 CEST 2017
IPC: H01L 23/538
H01L 25/065
Applicants: INTEL IP CORPORATION
Inventors: SEIDEMANN, Georg
WOLTER, Andreas
WAIDHAS, Bernd
WAGNER, Thomas
Title: VERTICAL AND LATERAL INTERCONNECTS BETWEEN DIES
Abstract:
Electronics devices, having vertical and lateral redistribution interconnects, are disclosed. An electronics device comprises an electronics component (e.g., die, substrate, integrated device, etc.), a die(s), and a separately formed redistribution connection layer electrically coupling the die(s) to the electronics component. The redistribution connection layer comprises dielectric layers on either side of at least one redistribution layer. The dielectric layers comprise openings that expose contact pads of the at least one redistribution layer for electrically coupling die(s) and components to each other via the redistribution connection layer. The redistribution connection layer is flexible and wrap/folded around side edges of die(s) to minimize vertical vias. Various devices and associated processes are provided.