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1. (WO2018182668) ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS

Pub. No.:    WO/2018/182668    International Application No.:    PCT/US2017/025257
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Apr 01 01:59:59 CEST 2017
IPC: H05K 3/40
H05K 3/46
H01L 23/48
Applicants: INTEL CORPORATION
Inventors: PHUN, Florence Su Sin
TAN, Wei Jern
KOH, Boon Ping
NIK ZURIN, Nik Mohamed Azeim
NG, Kai Chong
Title: ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
Abstract:
An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.