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1. (WO2018182647) APPARATUS WITH MULTI- WAFER BASED DEVICE COMPRISING EMBEDDED ACTIVE AND/OR PASSIVE DEVICES AND METHOD FOR FORMING SUCH
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/182647 International Application No.: PCT/US2017/025177
Publication Date: 04.10.2018 International Filing Date: 30.03.2017
IPC:
H01L 21/768 (2006.01) ,H01L 21/762 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
76
Making of isolation regions between components
762
Dielectric regions
Applicants: INTEL CORPORATION[US/US]; 2200 Mission College Blvd. Santa Clara, CA 95054, US
Inventors: PANCHOLI, Anup; US
MAJHI, Prashant; US
FISCHER, Paul B.; US
MORROW, Patrick; US
Agent: MUGHAL, Usman A.; US
Priority Data:
Title (EN) APPARATUS WITH MULTI- WAFER BASED DEVICE COMPRISING EMBEDDED ACTIVE AND/OR PASSIVE DEVICES AND METHOD FOR FORMING SUCH
(FR) APPAREIL À DISPOSITIF MULTI-TRANCHE COMPRENANT DES DISPOSITIFS ACTIFS ET/OU PASSIFS INTÉGRÉS ET SON PROCÉDÉ DE FORMATION
Abstract:
(EN) An apparatus is provided which comprises: a substrate; a first active device adjacent to the substrate; a first set of one or more layers to interconnect with the first active device; a second set of one or more layers; a second active and/or passive device coupled to the second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
(FR) L'invention concerne un appareil qui comprend : un substrat ; un premier dispositif actif adjacent au substrat ; un premier ensemble d'une ou plusieurs couches pour s'interconnecter avec le premier dispositif actif ; un second ensemble d'une ou plusieurs couches ; un second dispositif actif et/ou passif couplé au second ensemble d'une ou de plusieurs couches ; et une couche adjacente à l'une des couches des premier et second ensembles, la couche étant destinée à lier l'une des couches des premier et second ensembles.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)