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1. (WO2018182637) BOTTOM-UP FILL USING BLOCKING LAYERS AND ADHESION PROMOTERS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/182637 International Application No.: PCT/US2017/025127
Publication Date: 04.10.2018 International Filing Date: 30.03.2017
IPC:
H01L 21/768 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
Applicants: INTEL CORPORATION[US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors: HOURANI, Rami; US
CLENDENNING, Scott B.; US
KLOSTER, Grant M.; US
MAESTRE CARO, Aranzazu; US
GSTREIN, Florian; US
CHOWDHURY, Akm Shaestagir; US
MAHDI, Tayseer; US
Agent: WOLFSBERGER, Jonathan L.; US
PORTNOVA, Marina; US
OVANEZIAN, Daniel E.; US
Priority Data:
Title (EN) BOTTOM-UP FILL USING BLOCKING LAYERS AND ADHESION PROMOTERS
(FR) REMPLISSAGE VERTICAL À L'AIDE DE COUCHES DE BLOCAGE ET DE PROMOTEURS D'ADHÉRENCE
Abstract:
(EN) A device including a substrate formed of a material. The device includes a plurality of recessed features in a surface of the substrate, wherein the plurality of recessed features have an aspect ratio between 3:1-10:1, inclusive. The device includes a fill in the plurality of recessed features, wherein the fill is a second material that is different than the material of the substrate and wherein the fill covers sidewalls and bottom surfaces of the plurality of recessed features.
(FR) Cette invention concerne un dispositif comprenant un substrat formé d'un matériau. Le dispositif comprend une pluralité d'éléments évidés dans une surface du substrat, la pluralité d'éléments évidés ayant un rapport d'aspect allant de 3:1 à 10:1, inclus. Le dispositif comprend une charge de remplissage dans la pluralité d'éléments évidés, la charge remplissage étant un second matériau qui est différent du matériau du substrat et la charge de remplissage recouvrant les parois latérales et les surfaces inférieures de la pluralité d'éléments évidés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)