Search International and National Patent Collections

1. (WO2018182595) EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

Pub. No.:    WO/2018/182595    International Application No.:    PCT/US2017/024780
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Thu Mar 30 01:59:59 CEST 2017
IPC: H01L 23/31
H01L 21/56
H01L 21/67
Applicants: INTEL CORPORATION
Inventors: PIETAMBARAM, Srinivas V.
MANEPALLI, Rahul N.
AKKINEPALLY, Praneeth
JONES, Jesse C.
KANAOKA, Yosuke
SENEVIRATNE, Dilan
Title: EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
Abstract:
Described are microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.