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1. (WO2018182360) THICKNESS MEASUREMENT APPARATUS, THICKNESS MEASUREMENT METHOD, AND THICKNESS MEASUREMENT PROGRAM
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Pub. No.: WO/2018/182360 International Application No.: PCT/KR2018/003783
Publication Date: 04.10.2018 International Filing Date: 30.03.2018
IPC:
G01B 15/02 (2006.01) ,G06F 17/10 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
15
Measuring arrangements characterised by the use of wave or particle radiation
02
for measuring thickness
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
17
Digital computing or data processing equipment or methods, specially adapted for specific functions
10
Complex mathematical operations
Applicants:
한양대학교 산학협력단 IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) [KR/KR]; 서울시 성동구 왕십리로 222 222, Wangsimni-ro Seongdong-gu Seoul 04763, KR
Inventors:
김학성 KIM, Hak-Sung; KR
오경환 OH, Gyung Hwan; KR
김덕중 KIM, Deok Joong; KR
박동운 PARK, Dong Woon; KR
Agent:
특허법인 아이피에스 IPS PATENT FIRM; KR
Priority Data:
10-2017-004088730.03.2017KR
10-2017-007674616.06.2017KR
Title (EN) THICKNESS MEASUREMENT APPARATUS, THICKNESS MEASUREMENT METHOD, AND THICKNESS MEASUREMENT PROGRAM
(FR) APPAREIL DE MESURE D'ÉPAISSEUR, PROCÉDÉ DE MESURE D'ÉPAISSEUR ET PROGRAMME DE MESURE D'ÉPAISSEUR
(KO) 두께 측정 장치, 두께 측정 방법 및 두께 측정 프로그램
Abstract:
(EN) A thickness measurement apparatus is provided. The thickness measurement apparatus may comprise: a terahertz wave signal processing unit for receiving a terahertz wave according to at least one mode among a reflection mode and a transmission mode; a refractive index information acquisition unit for acquiring refractive index information of an object, the thickness of which is to be measured, by considering second time difference information between a first reflected terahertz wave and a second reflected terahertz wave; and a thickness information acquisition unit for acquiring thickness information of the object, the thickness of which is to be measured, by considering the acquired refractive index information.
(FR) La présente invention concerne un appareil de mesure d'épaisseur. L'appareil de mesure d'épaisseur peut comprendre : une unité de traitement de signal d'onde térahertz pour recevoir une onde térahertz selon au moins un mode parmi un mode de réflexion et un mode de transmission ; une unité d'acquisition d'informations d'indice de réfraction pour acquérir des informations d'indice de réfraction d'un objet, dont l'épaisseur doit être mesurée, en tenant compte de secondes informations de différence de temps entre une première onde térahertz réfléchie et une seconde onde térahertz réfléchie ; et une unité d'acquisition d'informations d'épaisseur pour acquérir des informations d'épaisseur de l'objet, dont l'épaisseur doit être mesurée, en tenant compte des informations d'indice de réfraction acquises.
(KO) 두께 측정 장치가 제공된다. 상기 두께 측정 장치는, 반사 모드 및 투과 모드 중 적어도 하나의 모드에 따른 테라헤르츠파를 수신하는 테라헤르츠파 신호 처리부, 상기 제1 반사 테라헤르츠파와 상기 제2 반사 테라헤르츠파 간의 제2 시간 차이 정보를 고려하여 상기 두께 측정 대상체의 굴절율 정보를 획득하는 굴절율 정보 획득부, 및 상기 굴절율 정보를 고려하여 상기 두께 측정 대상체의 두께 정보를 획득하는 두께 정보 획득부를 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)