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1. (WO2018182215) LIGHT-EMITTING MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/182215 International Application No.: PCT/KR2018/003175
Publication Date: 04.10.2018 International Filing Date: 19.03.2018
IPC:
H01L 25/075 (2006.01) ,H01L 33/58 (2010.01) ,H01L 33/36 (2010.01) ,H01L 33/50 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
Applicants: SEOUL SEMICONDUCTOR CO., LTD[KR/KR]; 97-11, Sandan-ro 163beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do 15429, KR
Inventors: LEE, Jong Min; KR
KIM, Bang Hyun; KR
LEE, Jae Ho; KR
Agent: AIP PATENT & LAW FIRM; 30-1, Teheran-ro 14-gil, Gangnam-gu, Seoul 06239, KR
Priority Data:
10-2017-003832227.03.2017KR
Title (EN) LIGHT-EMITTING MODULE
(FR) MODULE ÉLECTROLUMINESCENT
(KO) 발광 모듈
Abstract:
(EN) A light-emitting module is provided. The light-emitting module comprises: a base substrate; a first light-emitting diode positioned on the base substrate; and a second light-emitting diode positioned on the base substrate and spaced apart from the first light-emitting diode. The first light-emitting diode and the second light-emitting diode comprise a first light-emitting area and a second light-emitting area, respectively. The second light-emitting area is spaced apart from the first light-emitting area and surrounds the first light-emitting area.
(FR) L'invention concerne un module électroluminescent. Le module électroluminescent comprend : un substrat de base; une première diode électroluminescente positionnée sur le substrat de base; et une seconde diode électroluminescente positionnée sur le substrat de base et espacée de la première diode électroluminescente. La première diode électroluminescente et la seconde diode électroluminescente comprennent respectivement une première zone électroluminescente et une seconde zone électroluminescente. La seconde zone électroluminescente est espacée de la première zone électroluminescente et entoure la première zone électroluminescente.
(KO) 발광 모듈이 제공된다. 상기 발광 모듈은 베이스 기판; 베이스 기판상에 위치하는 제1 발광 다이오드; 및 베이스 기판상에 위치하되, 제1 발광 다이오드와 이격되는 제2 발광 다이오드를 포함하고, 제1 발광 다이오드 및 제2 발광 다이오드 각각은 제1 발광 영역 및 제2 발광 영역을 포함하고, 제2 발광 영역은 제1 발광 영역으로부터 이격되어 제1 발광 영역을 둘러싼다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)