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1. (WO2018182026) LABEL FOR IN-MOLD MOLDING AND LABELED RESIN MOLDED ARTICLE

Pub. No.:    WO/2018/182026    International Application No.:    PCT/JP2018/014000
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Sat Mar 31 01:59:59 CEST 2018
IPC: G09F 3/04
B29C 45/14
B32B 27/00
B32B 27/32
G09F 3/02
B65D 23/00
Applicants: YUPO CORPORATION
株式会社ユポ・コーポレーション
Inventors: IKARASHI Takuya
五十嵐 卓哉
NAKAMURA Kou
中村 綱
Title: LABEL FOR IN-MOLD MOLDING AND LABELED RESIN MOLDED ARTICLE
Abstract:
The present invention provides a label for in-mold molding with which adhesion between the label and a resin molded article can be maintained, and with which it is possible to separate a substrate layer or the like from an ink-receiving layer. The present invention pertains to: an in-mold molding label having, in the stated order, a substrate layer (A) containing a thermoplastic resin, an ink-receiving layer (B) containing a polyethylene-imine-based polymer, and a printing layer (C) having a polyethylene-based resin as a primary component; and a labeled resin molded article to which the label is affixed.