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1. (WO2018181767) SEMICONDUCTOR DEVICE PRODUCTION METHOD AND ADHESIVE SHEET

Pub. No.:    WO/2018/181767    International Application No.:    PCT/JP2018/013354
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: H01L 23/12
C09J 5/00
C09J 7/20
H01L 21/56
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: AKUTSU, Takashi
阿久津 高志
OKAMOTO, Naoya
岡本 直也
NAKAYAMA, Takehito
中山 武人
Title: SEMICONDUCTOR DEVICE PRODUCTION METHOD AND ADHESIVE SHEET
Abstract:
Provided are: a semiconductor device production method that includes steps (1)-(4) indicated below and that is a method for producing a semiconductor device using an adhesive sheet comprising an adhesive layer and a non-adhesive substrate containing expandable particles; and an adhesive sheet used in the production method. Step (1) is a step in which a frame member having an opening formed therein is attached to the adhesive surface of the adhesive layer. Step (2) is a step in which a semiconductor chip is placed on a part of the adhesive surface of the adhesive layer that is exposed in the opening of the frame member. Step (3) is a step in which the semiconductor chip, the frame member, and the adhesive surface of the adhesive layer on the periphery of the semiconductor chip are covered with a sealing material, the sealing material is cured, and a cured sealing body in which the semiconductor chip is sealed by the cured sealing material is obtained. Step (4) is a step in which the expandable particles are made to expand and the adhesive sheet is peeled from the cured sealing body. The present invention makes it possible to minimize the occurrence of positional displacement of a semiconductor chip in a production process for a fan-out package, has excellent productivity, and yields a semiconductor device having excellent flatness in a rewiring layer formation surface thereof.