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|1. (WO2018181767) SEMICONDUCTOR DEVICE PRODUCTION METHOD AND ADHESIVE SHEET|
|Title:||SEMICONDUCTOR DEVICE PRODUCTION METHOD AND ADHESIVE SHEET|
Provided are: a semiconductor device production method that includes steps (1)-(4) indicated below and that is a method for producing a semiconductor device using an adhesive sheet comprising an adhesive layer and a non-adhesive substrate containing expandable particles; and an adhesive sheet used in the production method. Step (1) is a step in which a frame member having an opening formed therein is attached to the adhesive surface of the adhesive layer. Step (2) is a step in which a semiconductor chip is placed on a part of the adhesive surface of the adhesive layer that is exposed in the opening of the frame member. Step (3) is a step in which the semiconductor chip, the frame member, and the adhesive surface of the adhesive layer on the periphery of the semiconductor chip are covered with a sealing material, the sealing material is cured, and a cured sealing body in which the semiconductor chip is sealed by the cured sealing material is obtained. Step (4) is a step in which the expandable particles are made to expand and the adhesive sheet is peeled from the cured sealing body. The present invention makes it possible to minimize the occurrence of positional displacement of a semiconductor chip in a production process for a fan-out package, has excellent productivity, and yields a semiconductor device having excellent flatness in a rewiring layer formation surface thereof.