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1. (WO2018181726) SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME

Pub. No.:    WO/2018/181726    International Application No.:    PCT/JP2018/013279
Publication Date: Fri Oct 05 01:59:59 CEST 2018 International Filing Date: Fri Mar 30 01:59:59 CEST 2018
IPC: C25D 7/06
B32B 15/08
C25D 1/04
C25D 5/16
H05K 1/03
Applicants: FURUKAWA ELECTRIC CO., LTD.
古河電気工業株式会社
MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: UNO Takeo
宇野 岳夫
OKUNO Yuko
奥野 裕子
TSURUTA Takahiro
鶴田 隆宏
NISHI Yoshimasa
西 芳正
FUKUTAKE Sunao
福武 素直
Title: SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME
Abstract:
This surface-treated copper foil (11) has, at least on one surface of a copper foil substrate, a surface-treatment film including at least a roughened surface on which roughening particles (111) are formed. When a cross-section of the surface-treated copper foil (11) is observed with a scanning electron microscope, the particle height of roughening particles (111) on the surface of the surface-treatment film have a standard deviation of 0.16 µm to 0.30 µm inclusive, and the average value of the ratio (particle height/particle width) of the height to width of the roughening particles (111) is 2.30 to 4.00 inclusive.